What is SK hynix building in Indiana and when is the groundbreaking ceremony?

SK hynix is building an advanced semiconductor packaging plant in West Lafayette, Indiana, and the groundbreaking ceremony is set for Aug. 27. The facility is described as the company’s first U.S. advanced packaging and R&D site.

Why is SK hynix investing $3.87 billion in its Indiana plant?

The investment is aimed at producing high bandwidth memory chips for artificial intelligence applications. The plant will also serve as an advanced packaging and research and development facility.

Who is expected to attend the SK hynix Indiana groundbreaking ceremony?

SK hynix CEO Kwak Noh-jung is expected to attend, along with CEOs and officials from major technology companies. SK Group Chairman Chey Tae-won may also attend, and Nvidia CEO Jensen Huang is speculated to join.

SK hynix to hold groundbreaking ceremony for Indiana chip packaging plant on Aug. 27

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Summary

SK hynix will hold a groundbreaking ceremony for its Indiana chip packaging plant on Aug. 27 in West Lafayette, industry sources said. The company plans to invest $3.87 billion in its first U.S. advanced packaging and R&D facility to make high bandwidth memory chips for AI applications. Chief Executive Officer Kwak Noh-jung is expected to attend, along with other tech executives and officials.

Key Facts

SK hynix plans to invest $3.87 billion in its first U.S. advanced packaging and research and development facility in West Lafayette, Indiana.
The plant is designed to produce high bandwidth memory chips for artificial intelligence applications.
SK Group Chairman Chey Tae-won may attend the ceremony, and Nvidia CEO Jensen Huang is also speculated to join.
SK hynix and Nvidia have worked together on global AI data center projects and on supplying memory chips and graphics processing units.

By Yonhap

Published Aug 12, 2026 5:07 pm KST

SK hynix headquarters in Icheon, Gyeonggi Province, July 29 / Yonhap

SK hynix will hold a formal groundbreaking ceremony for its new semiconductor packaging plant in the U.S. state of Indiana on Aug. 27, industry sources said Wednesday.

The Korean chipmaker has announced plans to invest $3.87 billion into its first U.S. advanced packaging and research and development (R&D) facility in West Lafayette, Indiana, to produce high bandwidth memory (HBM) chips for artificial intelligence (AI) applications.

SK hynix Chief Executive Officer (CEO) Kwak Noh-jung as well as a number of CEOs and officials from major technology companies are expected to attend the ceremony, according to the sources.

SK Group Chairman Chey Tae-won may attend the event, with speculation that Nvidia CEO Jensen Huang could also join the ceremony.

SK hynix and Nvidia have been partners in global AI data center projects, as well as in the supply of memory chips and graphics processing units (GPUs).

Chey and Huang have also held meetings frequently in Korea and the United States since last year.

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